Advanced Interconnections offers standard and custom designs, featuring new high density Board to Board Connectors, BGA Socketing Systems, and a wide variety of IC sockets and adapters for production, test, and development applications. Highly reliable, thru-hole and SMT designs feature screw-machined terminals available with patented options including eutectic solder balls or solder preforms. Many products are available with our patented, low-profile, Peel-A-Way® Removable Terminal Carrier.
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Product Overview
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Copyright © 2007 Advanced Interconnections Corp., West Warwick, RI 02893 USA. Products shown may be covered by patents issued and or pending. Specifications subject to change without notice. The Advanced logo, Advanced®, Advanced Interconnections®, Peel-A-Way®, B2B®, EMC®, Nurl-Loc®, Pop-Top®, True BGA Socket®, SocketPac®, and Murphy Circuits® are registered trademarks of Advanced Interconnections Corp. BGA Socket Finder, Proteksion, and Flip-Top are trademarks of Advanced Interconnections Corp.
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