Compact Socket Adapter System Now Available for 0.50mm pitch BGA and LGA Device Validation
West Warwick, RI, March 10, 2006 - Advanced Interconnections Corp. recently introduced a 0.50mm pitch BGA Socket Adapter System. A breakthrough in fine pitch socket technology, this new hybrid design utilizes both male and female pins in an interstitial pattern - offering the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, with no external hold-downs required, this patent pending design is perfect for development and validation of BGA and LGA devices, while offering superior electrical performance with very low signal attenuation up to 2.5GHz. Features and benefits include:
- Small overall size and same footprint as device - only 2.00mm larger than device
- Designed for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications
- Standard eutectic Tin/Lead solder balls or new lead-free Tin/Silver/Copper solder ball terminals for RoHS Compliant applications
- Unique alignment pins protect pin field and aid in hand placement with optional stand-offs available
- Data sheet and signal integrity simulation data including IBIS, HSPICE, and Touchstone models are available online
Advanced Interconnections Corporation is an ISO 9001:2000 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in Rhode Island (USA). For more information, contact Advanced Interconnections’ customer service department at 5 Energy Way, West Warwick, RI 02893 USA. Tel: (800) 424-9850 or (401) 823-5200 or Fax: (401) 823-8723.
E-mail: info@advanced.com. Product information available online at: www.bgasockets.com.