Material Specifications
Body Size
Device + 0.079/(2.00mm) in standard configuration [1.00mm per side; consult factory for even smaller sizes]
Mated Height
0.214/(5.44mm)* approx. (*will vary based on reflow profile, paste volume and PC board pad size)
Insulator
FR-4 Glass Epoxy, U.L. Rated 94V-0
Terminal
Brass - Copper Alloy (C36000) ASTM-B-16
Contact
Beryllium Copper
(C17200) ASTM-B-194
Solder Ball
0.50mm Pitch: 0.012/(0.30mm) Dia.
0.65mm Pitch: 0.014/(0.36mm) Dia.
Standard: 63Sn/37Pb (not RoHS Compliant)
Lead-free: 95.5Sn/4.0Ag/0.5Cu (0.65mm pitch)
Lead-free: 96.5Sn/3.0Ag/0.5Cu (0.50mm pitch)
Terminal Plating
Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
Note: Alignment pins are Nickel plated.