Description: Our line of Flip-TopTM BGA Sockets can be customized for a variety of applications.
Features:
- Stand-offs or "tower" designs to clear adjacent components
- Custom heat sinks for heat dissipation
- Off-pitch footprints
- Test board modules
- Test sockets for BGA, LGA, CSP, and QFP devices
- Contact one of our Product Engineers to get started or visit our BGA Socketing Systems page for more information on standard Flip-TopTM Test Sockets
Terminals: Solder ball SMT, Spring pin, thru-hole, and more
Body Material: Variety of insulator options including high temperature molded LCP, PPS, and FR-4 Fiberglass Epoxy Board