New B2B® Connectors Offer Robust Solution for SMT Board Stacking Applications
West Warwick, RI, August 24, 2006 - The new line of B2B® High Density SMT Connectors from Advanced Interconnections Corp. offers the industry's most robust solution for 1.27mm pitch surface mount board stacking applications. The B2B® Connector line employs screw-machined terminals with multi-finger contacts and the company's exclusive solder ball terminal design; field-proven for superior reliability and processing results. With a current rating of 3 Amps per pin, more contacts can be assigned to data/signal transfer (fewer pins are sacrificed for power/ground). These high quality terminals, coupled with a completely redesigned precision molded LCP insulator, offer a more rugged and durable contact system which is better suited for blind mating applications. B2B® High Density SMT Connector Features:
Advanced Interconnections Corporation is an ISO 9001 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in Rhode Island (USA). For more information, contact Advanced Interconnections’ customer service department at: 5 Energy Way, West Warwick, RI 02893 USA. Tel: (800) 424-9850 or (401) 823-5200 or Fax: (401) 823-8723. E-mail: info@advanced.com. B2B® is a registered trademark of Advanced Interconnections Corp.
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