Space Maximizing Flip-TopTM BGA Socket Now Available for 1.00mm Pitch Devices
West Warwick, RI, April 28, 2006 - Advanced Interconnections Corp. recently launched the next generation Flip-TopTM BGA Socket. Designed for development, test and validation of 1.00mm pitch BGA and LGA devices at speeds up to 2.6GHz (single-ended), the compact design requires no soldering of the IC and needs no external hold-downs or tooling holes in the PC board. The new series is available for either thru-hole or surface mount applications. Unique features include solder ball terminals (traditional Sn/Pb or new lead-free Sn/Ag/Cu), an integral finned heat sink or coin screw, and patented spring pin technology that matches the device footprint.
- Used for test and validation of 1.00mm pitch BGA and LGA devices at speeds of 2.6GHz (single-ended)
- Excellent single-ended insertion loss of -.060dB @2.6GHz and differential insertion loss of -2.80dB @ 5.0GHZ
- High temperature materials meet RoHS requirements for lead-free processing
- Robust design allows for high-cycle applications
- Excellent Near-end Crosstalk (<5%) and Far-end Crosstalk (<2%) values
- Data sheet and signal integrity simulation data including IBIS, HSPICE, and Touchstone models are available online
Advanced Interconnections Corporation is an ISO 9001:2000 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in Rhode Island (USA). For more information, contact Advanced Interconnections’ customer service department at 5 Energy Way, West Warwick, RI 02893 USA. Tel: (800) 424-9850 or (401) 823-5200 or Fax: (401) 823-8723.
E-mail: info@advanced.com. Product information available online at: www.bgasockets.com.