Flip Top Socket - Table of Models
Mounting Options Mounting/Terminal Type Designation
SMT Standard
SMT Standard
 SMT Standard

Terminal Type -860
Sn/Ag/Cu Solder Ball

Terminal Type -861
Sn/Pb Solder Ball

Note: See Application Spec. for recommended adhesive (epoxy) instructions*

SMT/Screw Mount
SMT/Screw Mount
 SMT/Screw Mount

Terminal Type -864
Sn/Ag/Cu Solder Ball

Terminal Type -865
Sn/Pb Solder Ball

Note: Screws provided for additional strain relief when needed; reflow still required*

SMT Plus
SMT Plus
 SMT/Screw Mount

Terminal Type -862
Sn/Ag/Cu Solder Ball

Terminal Type -863
Sn/Pb Solder Ball

Note: Additional solder balls provided for strain relief in low pin count SMT applications*

*See product Application Specification in Related Documents section for complete mounting details.

How to Order
Click Build-A-Part to build a device-specific part number.

Flip-Top - Sample Part Number
  • 4-point crown tip spring probes accurately align device solder balls, leaving only minimal witness marks to preserve the solder ball integrity
  • Click here to select a footprint or submit your device mechanical specifications to info@advanced.com
  • Device mechanical specifications are required prior to ordering to ensure accuracy of device-specific chip support plate
  • Sockets are packaged in foam-lined cartons




BGA Footprint Search

Mechanical specifications for BGA device package required
for quoting/ordering.

 

Back to Home