Advanced Interconnections Corp. is the world's leading manufacturer of IC
sockets and adapters for Ball Grid Array (BGA) package devices. Advanced's
patented eutectic solder ball terminals are standard on all of our BGA
sockets for proven long-term performance in vigorous temperature cycling
applications. Sockets and adapters for production and test applications are
available in standard and custom configurations (surface mount and thru-hole)
for high density packages down to .0315"(0.8mm) and .0295"(0.75mm) pitch.
Space-saving designs do not require external hold-downs, maximizing valuable
printed circuit board (PCB) space. Full line of test emulator adapters also
available.