New Lead-Free BGA Sockets in 1.00mm Pitch
West Warwick, RI, April 26, 2004 - To comply with the Restriction of Hazardous Substances (RoHS) Directive and other worldwide initiatives for lead-free manufacturing, Advanced is now offering lead-free solder ball terminal options on select BGA Sockets. The new sockets are molded from high temperature, glass filled thermoplastic, able to withstand the higher processing temperatures required in lead-free processing [up to 276°C (528°F)]. Lead-free, 1.00mm pitch, BGA Sockets in precision molded LCP wafers for both surface mount and thru-hole applications are available now. The surface mount sockets feature solder ball terminals made from a tin/silver/copper alloy with a reflow temperature of 218°C (424°F).
The full grid wafers are pin loaded to the exact footprint specified and are available in any footprint specific pattern up to 26 x 26 rows, to accommodate a BGA, LGA, or CSP device as large as 27mm square. Additional sizes and lead-free 1.27mm pitch sockets will be available soon. Advanced's industry proven, screw-machined terminals with multifinger contacts and gold plating ensure long-term durability and superior processing results. Mating adapters, custom designs, and tape and reel packaging are available. Prices vary with number of positions and options selected.
Complete how to order information and a data sheet, in PDF format, are available online at: http://www.advanced.com/socketadapterstart.html.
Advanced Interconnections Corporation is an ISO 9001 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in West Warwick, RI, USA. For more information, contact Advanced Interconnections' customer service department at: 5 Energy Way, West Warwick, RI USA. Tel: 800-424-9850 or 401-823-5200 / Fax: 401-823-8723 / E-mail: info@advanced.com.