Compact Socket Adapter System Now Available For 0.65mm pitch BGA and LGA Device Validation
West Warwick, RI, January 23, 2007 - Advanced Interconnections Corp. is now offering its new hybrid socket adapter design, which utilizes both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints.
The patented design features the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, with no external hold-downs required, this innovative system is designed for development and validation of BGA and LGA devices, production level socketing, and SMT board-to-board connector applications.
The new hybrid socket adapter design offers very low signal attenuation up to 3.5 GHz, and features standard eutectic tin/lead solder balls or new lead-free tin/silver/copper solder ball terminals for RoHS compliant applications. Unique alignment pins protect the pin field and aid in hand placement with optional stand-offs available. A data sheet and signal integrity simulation data and models for both 0.50mm and 0.65mm pitch models are available online at www.bgasockets.com. Consult factory for pricing and lead time which vary based on number of positions and options selected.
Advanced Interconnections Corporation is an ISO 9001:2000 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in Rhode Island (USA). For more information, contact Advanced Interconnections’ customer service department at 5 Energy Way, West Warwick, RI 02893 USA. Tel: (800) 424-9850 or (401) 823-5200 or Fax: (401) 823-8723. E-mail: info@advanced.com. Product information available online at: www.bgasockets.com.