Advanced Interconnections offers standard and custom designs, featuring new high density Board to Board Connectors, BGA Socketing Systems, and a wide variety of IC sockets and adapters for production, test, and development applications. Highly reliable, thru-hole and SMT designs feature screw-machined terminals available with patented options including eutectic solder balls or solder preforms. Many products are available with our patented, low-profile, Peel-A-Way® Removable Terminal Carrier.
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Product Overview
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Copyrightc 2007 Advanced Interconnections Corp., West Warwick, RI 02893 USA. Products shown may be covered by patents issued and or pending. Specifications subject to change without notice. The Advanced logo, Advanced®, Advanced Interconnections®, Peel-A-Way®, B2B®, EMC®, Nurl-Loc®, Pop-Top®, True BGA Socket®, SocketPac®, and Murphy Circuits® are registered trademarks of Advanced Interconnections Corp. BGA Socket Finder, Proteksion, and Flip-Top are trademarks of Advanced Interconnections Corp.
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