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高?互?公司提供?准与定制??,包括新的高密度?路板 - ?路板?接器、 BGA 插座系?、以及生?、??与???用的各? IC 插座与?配器。其高可靠、?孔与 SMT ??采用螺旋机械端接?利方案,包括共晶?球或??料。?多?品都采用具有?利技?的 Peel-A-Way® 小尺寸?掀式插座。 ?于定制?品,??系客?服?。
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从上面的菜?(包括完整的?品目?)中???品??,点?具体的?品名称可以快速?接?些高?特性: 技??范??特征、材料?范,更多 … | |||||
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Copyright © 2007 Advanced Interconnections Corp., West Warwick, RI 02893 USA. Products shown may be covered by patents issued and or pending. Specifications subject to change without notice. The Advanced logo, Advanced®, Advanced Interconnections®, Peel-A-Way®, B2B®, EMC®, Nurl-Loc®, Pop-Top®, True BGA Socket®, SocketPac®, and Murphy Circuits® are registered trademarks of Advanced Interconnections Corp. BGA Socket Finder, Proteksion, and Flip-Top are trademarks of Advanced Interconnections Corp. eCatalog technology powered by:
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