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高级互联公司提供标准与定制设计,包括新的高密度电路板 - 电路板连接器、 BGA 插座系统、以及生产、测试与开发应用的各种 IC 插座与适配器。其高可靠、过孔与 SMT 设计采用螺旋机械端接专利方案,包括共晶锡球或预焊料。许多产品都采用具有专利技术的 Peel-A-Way® 小尺寸轻掀式插座。 关于定制产品,请联系客户服务。
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![]() | Click here for our Product Overview Brochure in Chinese. | ![]() | ||
从上面的菜单(包括完整的产品目录)中选择产品种类,点击具体的产品名称可以快速链接这些高级特性: 技术规范——特征、材料规范,更多 … | |||||
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Copyrightc 2007 Advanced Interconnections Corp., West Warwick, RI 02893 USA. Products shown may be covered by patents issued and or pending. Specifications subject to change without notice. The Advanced logo, Advanced®, Advanced Interconnections®, Peel-A-Way®, B2B®, EMC®, Nurl-Loc®, Pop-Top®, True BGA Socket®, SocketPac®, and Murphy Circuits® are registered trademarks of Advanced Interconnections Corp. BGA Socket Finder, Proteksion, and Flip-Top are trademarks of Advanced Interconnections Corp. eCatalog technology powered by:
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