Interconnect Solutions from the Advanced® Tool Box on display at electronica 2018

AIC Tool BoxWest Warwick, R.I., USA, October 15, 2018 – Advanced Interconnections Corp. (AIC) will feature a broad array of interconnect solutions and technology from the company’s Tool Box at electronica 2018 in Munich from November 13-16 in Stand B2.144.
Board-to-Board Connectors, IC Sockets & Adapters, Ball Grid Array (BGA) Socketing Systems, and Package Conversion Adapters will be on display – all featuring the company’s hallmark screw-machined terminals. Featured lines include Mezza-pede® SMT Connectors and Peel-A-Way® Removable Terminal Carriers.
In addition to the company’s standard connectors, customized designs will be showcased, including unique applications of AIC’s proprietary solder sphere PCB interface (contact system) and image sensor sockets.
Visit AIC at Booth 144 in Hall B2 to prepare for your next interconnect project with application assistance from the company’s experienced technical sales team and free product samples. To request a specific meeting time at the electronica show, please contact Jim Murphy, International Sales Manager,

electronica, the world's leading trade fair and conference for electronics, takes place November 13-16, 2018 at at Messe München in Munich, Germany. For complete trade show information, visit

Advanced Interconnections Corp. | West Warwick, RI USA | | Tel: 401-823-5200 |