News

West Warwick, RI Nov 12, 2024 – Advanced Interconnections Corp. (AIC) headquartered in West Warwick, Rhode Island and leading designer and manufacturer of customized interconnect solutions for the electronics industry has launched a new Board to Board Connectors, which will be featured at electronica 2024 Stand B2. 130. These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available.
 
Many industrial, defense, aerospace, and automotive board designers are faced with the challenge of accounting for board to board interconnects that are ever denser and requiring higher speeds than legacy solutions. Moreover, there is a demand for these highly dense connectors to also be pick-and-place accessible for ease of mass manufacturing. Developing fine-pitch, high-speed connectors that can withstand harsh environmental conditions is an extreme challenge, especially considering how small and fragile such compact contacts are intrinsically. Fortunately, AIC is up for such a challenge and has designed a new series of board to board connectors that are uniquely suited to modern PCB interconnect challenges.
 
Designed for long-life applications and robust handling, these new connectors are manufactured with screw-machined terminations with multi-finger contacts and include a wealth of value-added features and come with either protective pick-and-place covers or heavy duty, shrouded insulators. The options of covers or insulators helps to provide positive polarization and offer superior durability for the connectors. Available in standard pitch sizes including 0.50 mm, 0.65 mm, 0.75, 0.80 mm, and 1.00 mm, these connectors deliver low signal attenuation, insertion loss, and return loss. Even with adjacent aggressor excitation, the socket systems provide a differential path of +/- 175mV @ 100 psec and a single-ended data path of +/- 125 mV @ 140 psec. Using innovative, hybrid design features, this socket technology is able to minimize adjacent terminal electromagnetic coupling, which significantly reduces NeXT/FeXT. Additionally, this hybrid design creates a pseudo-matched impedance environment that stabilizes the insertion loss and return loss when differentially driven.
 
These board to board connectors with field-proven screw machined terminals are arranged in an interstitial male/female pin pattern that sport gold-plated contacts for high-quality gold/gold interconnect. This added gold plating on the connector contacts minimizes corrosion in most environments and provides extremely long life contacts capable of repeated matching cycles.
 
Unlike many other board to board connectors on the market, AIC’s new connectors do not require external hold-downs and include a shrouding feature that protects the pin field and aids in manual placement. These new connectors can be selected with either eutectic Tin/Lead or lead-free Tin/Silver/Copper solder ball terminals for RoHS compliant applications. Optional stand-offs are also available with these connectors.
 
AIC’s new Board to Board Connections are now available in a variety of standard options with the ability to readily customize standard offerings for application-specific requirements, please call +1 401.823.5200 or visit stand B2. 130 at electronica 2024.
 
About Advanced Interconnections Corp:
Advanced Interconnections is the premier designer and manufacturer of off-the-shelf and custom interconnect solutions for the electronics industry. The reliability and innovative solutions Advanced has pioneered have flown the skies, swam the seas, ridden the wild backcountry, and kissed the stars for a diverse range of telecommunications, military/government, automotive, medical, aerospace, and naval/maritime applications. Advanced Interconnections’ skilled team of engineers have developed a range of field-proven IC sockets, package conversion adapters, board-to-board connectors, and a plethora of custom interconnect solutions. From prototype to production volumes and anywhere along the journey, Advanced is able to meet even extreme interconnect and specification requirements at our fully integrated manufacturing facility in the USA.