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New Video: Flip-Top BGA Sockets Ease Device Test

Feb 11 '13
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Our new video shows how easy the Flip-Top™ BGA Socket is to use for device test and validation. The video illustrates how the compact design uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. Highlighted features include the hinged clamp, with integral heat sink, which makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to each specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to ensure a reliable electrical connection. Watch our new video to find out more. Advanced Interconnections Corp. | West Warwick, RI USA | www.advanced.com | Tel: 401-823-5200 | info@advanced.com

Tags: Flip-Top, advanced interconnections, sockets, test socket, video

Providing Customized Interconnect Solutions for Over 35 Years.
© 2012-2024 Advanced Interconnections Corp., West Warwick, RI USA
For details relating to proprietary information protected by patents, go to www.advanced.com/patents

Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.

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You are viewing 1 post with the tag Flip-Top

New Video: Flip-Top BGA Sockets Ease Device Test