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AIC Connector Article Featured in U.S. Tech

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Advanced Interconnections Corp. US Tech Articleis pleased to be published in the May 2017 issue of U.S. Tech - the premier global publication of the electronics manufacturing industry. The article titled "Reducing Stack Height with Low-Profile Connectors" by Glenn Goodman, Senior Development Engineer, discusses design considerations, challenges, and solutions for low-profile board to board connectors. 

Mezza-pede® SMT Connectors, which were specifically designed to meet z-axis constraints, are cited as an example of how a number of connector design elements contribute to the achievable stack height.

Please click here to download a copy of the article.

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