Advanced Interconnections Corp.
is pleased to be published in the May 2017 issue of U.S. Tech - the premier global publication of the electronics manufacturing industry. The article titled "Reducing Stack Height with Low-Profile Connectors" by Glenn Goodman, Senior Development Engineer, discusses design considerations, challenges, and solutions for low-profile board to board connectors.
Mezza-pede® SMT Connectors, which were specifically designed to meet z-axis constraints, are cited as an example of how a number of connector design elements contribute to the achievable stack height.
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Advanced Interconnections Corp. | West Warwick, RI USA | www.advanced.com | Tel: 401-823-5200 | email@example.com