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Unique Application of Solder Ball Technology

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Advanced Interconnections Corp. recently published an Application Note AIC Application Note 2015-01featuring our Solder Sphere Interface. This patented technology is used on QFP Adapters and Interposers, to convert QFP, BGA, and other devices for use on boards with QFP footprints ("pads" or "lands"). It's just one of the many innovative ideas from our Tool Box...applying our industry-proven solder ball interface to QFP adapters and interposers, to eliminate the processing issues associated with gull wing leads. Download the Application Note to learn more or contact one of our Product Engineers to find out how we can help you preserve your existing PC Board layouts.

Advanced Interconnections Corp. | West Warwick, RI USA | | Tel: 401-823-5200 |