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New Video: Flip-Top BGA Sockets Ease Device Test

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Our new video shows how easy the Flip-Top™ BGA Socket is to use for device test and validation. The video illustrates how the compact design uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. Highlighted features include the hinged clamp, with integral heat sink, which makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to each specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to ensure a reliable electrical connection. Watch our new video to find out more. Advanced Interconnections Corp. | West Warwick, RI USA | | Tel: 401-823-5200 |