BGA Socketing Systems

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BALL GRID ARRAY: TEST • VALIDATE • UPGRADE


BGA Socket Adapter Systems from Advanced Interconnections Corp. convert surface mount device packages to thru-hole (pinned) assemblies, making it easy to plug and unplug SMT packages, such as BGA, LGA, or CSP. A practical and economical solution for applications that require future device upgrades, field programming at point of use, or the ability to quickly swap out devices in the field or during test & development. BGA Socket Adapter Systems protect valuable PC boards and save time by eliminating the need to de-solder packages during device removal.
  • Compact Ball Grid Array Socket designs maximize board space
  • Used by industry-leading semiconductor companies and OEMs in test, development and validation applications
  • Build-A-Part online
  • High reliability solder ball terminals
  • Use with BGA, LGA, or CSP device packages
  • Over 2,000 BGA footprints available - Search online
  • Download the BGA Data Book for data sheets and how to order infoBGA Data Book