Advanced Interconnections | BGA Socketing Systems

BGA Socketing Systems

BALL GRID ARRAY: TEST • VALIDATE • UPGRADE

BGA Socket Adapter Systems from Advanced Interconnections Corp. convert surface mount device packages to thru-hole (pinned) assemblies, making it easy to plug and unplug SMT packages, such as BGA, LGA, or CSP. A practical and economical solution for applications that require future device upgrades, field programming at point of use, or the ability to quickly swap out devices in the field or during test & development. BGA Socket Adapter Systems protect valuable PC boards and save time by eliminating the need to de-solder packages during device removal.

BGA Footprint Finder

Online database of over 2,000 BGA Footprints
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Build-A-Part™ Number Online

Build a complete part number using our Build-A-Part online product configurator
Integrated Footprint selector tool
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BGA Data Book

Download the BGA Data Book for data sheets and how to order info

Providing Customized Interconnect Solutions for Over 35 Years.
© 2012-2024 Advanced Interconnections Corp., West Warwick, RI USA
For details relating to proprietary information protected by patents, go to www.advanced.com/patents

Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.