BGA Socketing Systems

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BALL GRID ARRAY: TEST • VALIDATE • UPGRADE


BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
  • Compact Ball Grid Array Socket designs maximize board space
  • Used by industry-leading semiconductor companies and OEMs in test, development and validation applications
  • Build-A-Part online
  • Lead-free and Tin/Lead options
  • High reliability solder ball terminals
  • Use with BGA, LGA, or CSP device packages
  • Over 2,000 BGA footprints available - Search online
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