BGA Interposers

BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.

BGA Interposers Data Sheets & Documentation


Type Title & Description Rev. File Size
Data Booklet BGA Socketing Systems Data Book
Micro-BGA and BGA Socket Adapter Systems and Flip-Top™ BGA Sockets
17-2 BGA Data Booklet 6 MB
Data Sheet Lead-free to Tin/Lead BGA Interposer Data Sheet 0 BGA Interposer Data Sheet 673 KB
Application
Doc.
Typical Soldering Process Examples - Tin/Lead and Lead-free Generic Reflow Profiles 0 Generic Solder Reflow Profiles 100 KB

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