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BGA Interposers
BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.
Overview
How It Works
Table of Models
Documentation
BGA Interposers Data Sheets & Documentation
Type
Title & Description
Rev.
File
Size
Data Booklet
BGA Socketing Systems Data Book
Micro-BGA and BGA Socket Adapter Systems and Flip-Top™ BGA Sockets
17-2
6 MB
Data Sheet
Lead-free to Tin/Lead BGA Interposer Data Sheet
0
673 KB
Application
Doc.
Typical Soldering Process Examples
- Tin/Lead and Lead-free Generic Reflow Profiles
0
100 KB
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