Advanced Interconnections

Typical Lead-free to Tin/Lead Example

We attach the lead-free BGA devices to customized Interposer adapter boards featuring eutectic (63/37) Tin/Lead solder balls (on the bottom of the Interposers).

The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components on the PC board to higher processing temperatures.

Using an intersposer is preferable to reballing Lead-free BGA devices in RoHS-exempt applications, because reballing can introduce contamination, weakening the solder joint while also exposing the devices to extra reflow (heat) cycles.

Providing Customized Interconnect Solutions for Over 35 Years.
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Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.

BGA Interposers

Typical Lead-free to Tin/Lead Example