Interposers overcome the increasing obsolescence of Tin/Lead device packages by converting the new Lead-free devices back to Tin/Lead, eliminating the need to respin boards or qualify new reflow profiles in RoHS-exempt applications.
Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages.
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Reduces costs associated with device package transition or obsolescence.
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Lead-free device attach service provided.
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Industry-proven solder ball terminal design provides the high reliability required in medical, military, telecom, and automotive applications.
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High temperature FR-4 adapter board closely matches original package size.
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Same footprint as BGA device (currently available in 0.80, 1.00, and 1.27mm pitch).
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Custom designed to customer's requirements.
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Tape and Reel packaging available.
Interposers are customized for each specific device and application. Contact your local Authorized Distributor or Representative with your application requirements.