SMT Value Added Services

We work with customer-supplied devices or will purchase your specified IC to provide a one-stop service including device procurement, adapter production, device attach, and optional tape and reel packaging – simplifying the process and ensuring quality control from start to finish. From 0.50mm to 1.27mm pitch, our value added services will reduce your costs and streamline the process.

BGA Solder Ball Re-attach Services are also available to restore previously used BGA devices to usable condition - perfect for expensive or hard to find BGA devices.

• Available for virtually any BGA device in .050" (1.27mm) or .039" (1.0mm) pitch with standard 63Sn/37Pb solder ball composition.
• BGA devices to be supplied with complete device mechanical specifications.
• X-Ray, electrical testing and serialization available.
• Advanced works to IPC standards (IPC-A-610-B), class III.

Typical Application
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