Flip-Top™ BGA Test Sockets

Easy to Use and Compact Size
The compact Flip-Top™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to ensure a reliable electrical connection. 

• No soldering of the device required.
• Same footprint as BGA or LGA device - over 1,000 footprints available in our online database.
• Compact, low-profile design maximizes PC board space and requires no external screws or mounting holes in the PC board - suitable for use on design boards.
• Available with integral, finned heat sink or coin-screw retention clamp.
• Surface mount and thru-hole designs available.
• Customized designs are available to provide clearance for nearby components on boards with tight keepout zones.
• Tin/lead and Lead-free terminal options.
• Available in 0.50mm, 1.00mm, and 1.27mm pitch designs.