Flip-Top™ BGA Test Sockets

Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.

Mechanical & Electrical Performance

  0.50mm Pitch 1.00mm Pitch
Durability/Cycles: 500 minimum Consult factory
Current Carrying Capacity: 2.8 Amps Max. Consult factory
Probe Contact Force: 18 g (per position)  
Probe Contact Resistance: 80 mOhms  
     
Signal Integrity Overview:   Even with adjacent Aggressor
excitation, our socket system
provides a Differential Data path of
± 175mV @ 100psec and a
Single-ended Data path of
± 125mV @ 140psec.
Differential Insertion Loss: -0.6db @ 2.6 GHz   
-0.2db @ 1.3 GHz   		 -0.30dB @ 0.76 GHz
-0.60dB @ 1.25 GHz
Differential Return Loss: -10db @ 2.6 GHz
-15db @ 1.3 GHz     		 -15.0dB @ 0.76 GHz
-10.0dB @ 1.25 GHz
Single-ended Insertion Loss:
(Interior Pins)		 -10db @ 8.0 GHz
-15db @ 3.5 GHz		 -0.35dB @ 0.90 GHz
-0.75dB @ 1.70 GHz
Single-ended Insertion Loss:
(Exterior Pins)		   -0.40dB @ 1.30 GHz
-0.70dB @ 2.30 GHz
Single-ended Return Loss:
(Interior Pins)		 -2.1db @ 8.0 GHz
-0.9db @ 3.5 GHz		 -15.0dB @ 0.90 GHz
-10.0dB @ 1.70 GHz
Single-ended Return Loss:
(Exterior Pins)		   -15.0dB @ 1.30 GHz
-10.0dB @ 2.30 GHz
Signal Integrity Simulation
and Modeling Overview
(SI Profiles, Crosstalk,
Eye-Diagrams and
Conclusions in PDF format)		   Flip-Top Signal Integrity Analysis
SI Models
(Zip file containing HSPICE,
IBIS, and Touchstone formats,
and ReadMe Text)		   Consult Rep or
Distributor
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