Flip-Top™ BGA Test Sockets

1.00mm and 1.27mm Pitch Flip-Top™ Test Socket Models

Flip-Top Test Socket is designed to save space on new and existing PC boards in test, devlopment, programming, and production applications. Suitable for use with BGA, LGA, or de-balled BGA devices. No external hold-downs (screws, etc.) are required.

(Scroll down for 0.50mm pitch models.)

	1.00mm Pitch	1.27mm Pitch
Model:	FRH	FRG
Device Packages Supported:	BGA, LGA, or De-balled BGA	BGA, LGA, or De-balled BGA
Terminal Type Options:	SMT or Thru-hole	SMT or Thru-hole
Clamp Options:	Heat Sink (3 Fins Std.) or Coin Screw	Heat Sink (3 Fins Std.) or Coin Screw
Socket Size for Devices up to 15.00mm square:	0.709/(18.00mm) W  x 0.984/(25.00mm) L	0.709/(18.00mm) W  x 0.984/(25.00mm) L
Socket Size for Devices 15.00mm square and larger:	3.00mm wider and 10.00mm longer than the device	3.00mm wider and 10.00mm longer than the device
RoHS Compliant Status:	RoHS Compliant with Lead-free solder ball terminals or thru-hole models.	RoHS Compliant with Lead-free solder ball terminals or thru-hole models.

0.50mm Pitch Mod5 Series Flip-Top™ Test Socket Models

This micro-BGA test socket is designed to accommodate BGA packages up to 12.00mm square (22 x 22 rows), with larger sizes available upon request. Precision machined spring probes offer high bandwidth with very low insertion loss. The compact design enables use on design boards.

	SMT Standard	SMT/Screw Mount	SMT Plus
Model:	FRM	FRM	FRM
Pitch:	0.50mm	0.50mm	0.50mm
Devices Packages Supported:	BGA (Consult factory for QFN or LGA)	BGA (Consult factory for  QFN or LGA)	BGA (Consult factory for  QFN or LGA)
Terminal Type Options:	Terminal Type designates mounting option. See data sheet.
	SMT	SMT	SMT
Mounting Option:
Note:	1. See Application Spec. for recommended adhesive (epoxy) instructions.	2. Screws provided for additional strain relief when needed; reflow still required.	3. Additional solder balls provided for strain relief in low pin count applications.
Clamp Options:	Turn-Screw Heat Sink with 1 Fin or 3 Fins	Turn-Screw Heat Sink  with 1 Fin or 3 Fins	Turn-Screw Heat Sink  with 1 Fin or 3 Fins
Socket Size: For packages up to 12.00mm sq. (22 x 22 rows)	0.79/(20.00mm) W x 1.06/(27.00mm) L	0.79/(20.00mm) W x 1.06/(27.00mm) L	0.79/(20mm) W x 1.06/(27.00mm) L
RoHS Compliant Status:	RoHS Compliant with Lead-free solder ball terminals.	RoHS Compliant with Lead-free solder ball terminals.	RoHS Compliant with Lead-free solder ball terminals.