Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.
For device packages up to 12.00mm square:
X = 0.79/(20.00mm)
Y = 1.06/(27.00mm)
Consult Factory for larger device packages.
For package sizes 15.00mm square and larger:
0.12/(3.00mm) wider and 0.40/(10.00mm) longer than the BGA device
For package sizes smaller than 15.00mm square, the socket size is:
X = 0.709/(18.00mm)
Y = 0.984/(25.00mm) Rectangular packages will be designed in a square socket size.
Socket Height:
0.68/(17.4mm) approx. (Will vary based on reflow profile, paste volume, etc.)
Made in the USA
Designed-in Globally
401-823-5200