Flip-Top™ BGA Test Sockets

Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.

  0.50mm Pitch 1.00mm and 1.27mm Pitch
Terminals: Spring Probe
Crown-point Plunger: Tool Steel
Terminal: Brass; Copper Alloy (C36000)
Brass; Copper Alloy (C36000)
Contacts: Not applicable Beryllium Copper; Copper Alloy (C17200)
Plating:  Gold over Nickel
(Terminals and Contacts)
Gold over Nickel 
(Terminals and Contacts)
Terminal Support: Not applicable Polyimide Film
Spring: Stainless Steel (Gold plated) Stainless Steel
Standard Solder Balls: 63Sn/37Pb, Eutectic
183°C (361.4°F)
63Sn/37Pb, Eutectic
183°C (361.4°F)
Lead-free Solder Balls: 96.5Sn/3.0Ag/0.5Cu
218°C (424°F)
218°C (424°F)
Lid, Latch,
Heat Sink/Coin Screw,
and Support Plate:
Anodized Aluminum Anodized Aluminum
Guide Box: Molded PPS - High Temperature Glass Filled Thermoplastic Molded PPS - High Temperature Glass Filled Thermoplastic
Guide Box Screws: 18-8 Stainless Steel 18-8 Stainless Steel
Base Socket: FR-4 Glass Filled Epoxy 1.00mm Pitch: FR-4 Glass Filled Epoxy
1.27mm Pitch: Molded LCP - Liquid Crystal Polymer
Mechanical [inch/(mm)] [inch/(mm)]
Socket Size: For device packages up to 12.00mm square:
X = 0.79/(20.00mm)
Y = 1.06/(27.00mm)

Consult Factory for larger device packages.
For package sizes 15.00mm square and larger:
0.12/(3.00mm) wider and 0.40/(10.00mm) longer than the BGA device

For package sizes smaller than 15.00mm square, the socket size is: 
X = 0.709/(18.00mm)
Y = 0.984/(25.00mm)
Rectangular packages will be designed in a square socket size.
Socket Height: 0.68/(17.4mm) approx.
(Will vary based on reflow profile, paste volume, etc.)
Device Packages Supported: BGA
(Consult Factory for QFN and LGA)
BGA, LGA, and De-balled BGA


    • Flip-Top BGA Test Socket
    • Mod5 Series Flip-Top BGA Socket
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