SMT Adapters

Using our exclusive, field-proven solder ball terminal design, SMT Adapters from Advanced provide a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board applications.

Materials  
Terminals: Brass; Copper Alloy (C36000)
Contacts: Beryllium Copper; Copper Alloy (C17200)
Plating:  Gold over Nickel (Terminals and Contacts)
Solder Balls: Standard: 63Sn/37Pb, Eutectic, 183°C (361.4°F)
Lead-free: 95.5Sn/4.0Ag/0.5Cu, 218°C (424°F)
Body Material: Varies by Body Type and Pitch (see below and refer to Data Sheet)
  F - FR-4 glass epoxy
U.L. Rated 94V-0, -40°C to 140°C (-40°F to 284°F) 
[for RoHS Compliant applications]
  M (in 1.27mm pitch) - Molded PPS (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -60°C to 260°C (-76°F to 500°F) [not for use in RoHS Compliant applications due to processing temperatures - see LCP material below]
  R (in 1.27mm pitch) - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant applications]
  M (in 1.00mm pitch) - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant applications]
   

BGA/LGA SMT Adapter
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