BGA Socket Adapter Systems

Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.

Fine Pitch (0.50mm and 0.65mm) Models 
Mechanical & Electrical Performance
Even with adjacent Aggressor excitation, our fine pitch socketing system provides a Differential Data path of ± 175mV @ 100psec and a Single-ended Data path of ± 125mV @ 140psec.

Innovative hybrid design ensures that adjacent terminal electromagnetic coupling is trivial; greatly reducing NeXT & FeXT, while creating a pseudo-matched impedance environment; stabilizing the Insertion & Return Loss response rates.

  0.50mm Pitch 0.65mm Pitch
Insertion Force: 35g avg. (per pin) 35g avg. (per pin)
Extraction Force: 30g avg. (per pin) 30g avg. (per pin)
Differential Insertion Loss: -0.40dB @ 1.0 GHz
-0.55dB @ 1.9 GHz
-0.25dB @ 3.5 GHz
Differential Return Loss: -15.0dB @ 1.0 GHz
-10.0dB @ 1.9 GHz
-14.0dB @ 3.5 GHz
Single-ended Insertion Loss: -0.55dB @ 1.6 GHz
-0.90dB @ 3.3 GHz
-0.25dB @ 3.5 GHz
Single-ended Return Loss: -15.0dB @ 1.6 GHz
-10.0dB @ 3.3 GHz
-20.0dB @ 3.5 GHz
Signal Integrity Simulation and Modeling 
(SI Profiles, Crosstalk, Eye-Diagrams and
Conclusions in PDF format)
B2B Connectors Signal Integrity Presentation B2B Connectors Signal Integrity Presentation
SI Models 
(Zip file containing HSPICE, 
IBIS, and Touchstone formats, 
and ReadMe Text)
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Distributor
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0.80mm and 1.00mm Pitch Models 
Mechanical & Electrical Performance
Even with adjacent Aggressor excitation, our socket system provides a Differential Data path of ± 175mV @ 100psec and a Single-ended Data path of ± 125mV @ 140psec.

  0.80mm Pitch 1.00mm Pitch
Insertion Force: Consult Factory Consult Factory
Extraction Force: Consult Factory Consult Factory
Differential Insertion Loss: -0.20dB @ 0.8 GHz
-0.40dB @ 1.4 GHz
<-0.10dB @ <1.5 GHz
-0.20dB @ 3.1 GHz
Differential Return Loss: -15.0dB @ 0.8 GHz
-10.0dB @ 1.4 GHz
-15.0dB @ 1.5 GHz
-10.0dB @ 3.1 GHz
Single-ended Insertion Loss:
(Interior Pins)
-0.20dB @ 1.0 GHz
-0.60dB @ 2.0 GHz
<-0.10dB @ GHz
-.060dB @ 2.0 GHz
Single-ended Insertion Loss:
(Exterior Pins)
-0.30dB @ 1.5 GHz
-0.70dB @ 2.9 GHz
-0.20dB @ 4.8 GHz
-0.60dB @ 7.6 GHz
Single-ended Return Loss: -15.0dB @ 1.0 GHz
-10.0dB @ 2.0 GHz
-15.0dB @ 2.8 GHz
-50.0dB @ 5.4 GHz
Signal Integrity Simulation and Modeling 
(SI Profiles, Crosstalk, Eye-Diagrams and
Conclusions in PDF format)
B2B Connectors Signal Integrity Presentation B2B Connectors Signal Integrity Presentation
SI Models 
(Zip file containing HSPICE, 
IBIS, and Touchstone formats, 
and ReadMe Text)
Consult Rep or
Distributor
Search
Consult Rep or
Distributor
Search

1.27mm Pitch Models
Mechanical and Electrical Peformance

Test Results for 1.27mm Pitch, Low Force Contacts (P/N 1427-1G) - Test Report No. 92351A

  1.27mm Pitch
Durability:
50 Cycles at 1 inch per minute, followed by Low Level Resistance Test.
3.1 m Ohm Average, +0.1 m Ohm average change
Initial insertion force: 28.5g average (1.0 oz. average)
Initial withdrawal force: 18.5g average (0.7 oz. average)
Vibration:
MIL-STD 1344, Method 2005 Test, Condition III, 15 G's followed by Low Level Resistance Test.
2.8 m Ohm Average, -0.0 m Ohm average change
Gas Tight:
Exposed in a sealed container to concentrated Nitric Acid (NHO3) followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.5 m Ohm average change
Moisture Resistance:
Temperature cycling with humidity MIL-STD 1344, Method 1002, Type II, followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.7 m Ohm average change
Shock:
MIL-STD 1344, Method 2004, Test Condition A.
No mechanical damage or loss of continuity
Thermal Cycle:
MIL-STD 1344, Method 1003, Test Condition A.
3.4 m Ohm Average, +0.7 m Ohm average change
Temperature Life:
MIL-STD 1344, Method 1005, Test Condition 2.
3.8 m Ohm Average, +0.8 m Ohm average change
Porosity:
MIL-STD 1344, Method 1017
No porosity
Contact Resistance:
MIL-STD 1344, Method 3002, measured using 100m amp test current.
3.0 m Ohm average
Self Inductance:* 2.52 nH Average at 1 GHz
Mutual Inductance:* 2.26 nH Average at 1 GHz
   
*From Test Report No. 96313, consult factory for other frequencies.
    • 0.80mm BGA Socket Adapter System
    • BGA Device Socket Adapter System
    • AIC Fine Pitch BGA Socket Adapter System
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