BGA Socket Adapter Systems

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0.50mm and 0.65mm Pitch Models

The micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The proprietary design alternates male and female pins in an interstitial pattern - offering the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, this compact design is perfect for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications.

Unique alignment pins protect pin field and aid in hand placement with optional stand-offs available. Sockets and Adapters are provided with protective covers which facilitate automated pick-and-place and protect pins during storage (before & after assembly). 

	Standard Socket	Standard Adapter	SMT Adapter
Model:	FMS | FLS	FMA | FLA	FMA | FLA (Select SMT Terminal Type)
Pitch:	0.50mm | 0.65mm	0.50mm | 0.65mm	0.50mm | 0.65mm
Insulator Size:	Device + .079/(2.00mm)	Device + .079/(2.00mm)	Device + .079/(2.00mm)
Insulator Material:	FR-4 (Fiberglass Epoxy Board)	FR-4 (Fiberglass Epoxy Board)	FR-4 (Fiberglass Epoxy Board)
RoHS Compliant Status:	RoHS Compliant with Lead-free solder ball terminals.	RoHS Compliant	RoHS Compliant with Lead-free solder ball terminals.

0.80mm, 1.0mm, and 1.27mm Pitch Models

Our compact Socket Adapter System is available in a variety of configurations to suit virtually any application, including standard, extraction slot, male to male, and SMT adapters for connecting to an LGA device or a PC board for use as a high density board to board connector.

	Standard Socket	Standard Adapter	SMT Adapter
Model:	FJS | MHS | RGS	FJA | FHA | FGA	FJA | FHA | FGA (Select SMT Terminal Type)
Pitch:	0.80mm | 1.00mm | 1.27mm	0.80mm | 1.00mm | 1.27mm	0.80mm | 1.00mm | 1.27mm
Insulator Size:	Same Size as Device Pkg.	Device Pkg. + .079/(2.00mm)	Device Pkg. + .079/(2.00mm)
Insulator Material:	0.80mm: FR-4 1.00 and 1.27mm: Molded LCP	FR-4 (Fiberglass Epoxy Board)	FR-4 (Fiberglass Epoxy Board)
RoHS Compliant Status:	RoHS Compliant with Lead-free solder ball terminals.	RoHS Compliant	RoHS Compliant with Lead-free solder ball terminals.
Extraction Models for High I/O Device Packages
Extraction Models are designed for high I/O (ball count) packages to facilitate device/adapter assembly removal from socket with AIC Extraction Tool (available separately). Protects PC board during extraction - tool never touches the PC board.
	Extraction Socket	Extraction Slot Adapter	SMT Extraction Slot Adapter
Model:	MHSB | RGSB (Bottom and Top views shown)	FHAX | FGAX (Bottom view shown)	FHAX | FGAX (Select SMT Terminal Type)
Pitch:	1.00mm | 1.27mm	1.00mm | 1.27mm	1.00mm | 1.27mm
Insulator Size:	1.00mm Pitch: Device + .138/(3.50mm) 1.27mm Pitch: Device + .079/(2.00mm)	Device + .157/(4.00mm)	Device + .157/(4.00mm)
Insulator Material:	Molded LCP (Liquid Crystal Polymer)	FR-4 (Fiberglass Epoxy Board)	FR-4 (Fiberglass Epoxy Board)
RoHS Compliant Status:	RoHS Compliant with Lead-free solder ball terminals.	RoHS Compliant	RoHS Compliant with Lead-free solder ball terminals.