BGA Socket Adapter Systems

Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.

 
Materials  
Terminals: Brass; Copper Alloy (C36000)
Contacts: Beryllium Copper; Copper Alloy (C17200)
Plating:  Gold over Nickel (Terminals and Contacts)
Solder Balls: Standard: 63Sn/37Pb, Eutectic, 183°C (361.4°F)
Lead-free: Tin/Silver/Copper Alloy, 218°C (424°F)
0.50mm Pitch: 96.5Sn/3.0Ag/0.5Cu
0.65mm through 1.27mm Pitch: 95.5Sn/4.0Ag/0.5Cu
Body Material: Varies by Body Type and Pitch (see below and refer to Data Sheet)
  F - FR-4 glass epoxy
U.L. Rated 94V-0, -40°C to 140°C (-40°F to 284°F) 
[for RoHS Compliant applications]
  M (in 1.27mm pitch) - Molded PPS (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -60°C to 260°C (-76°F to 500°F) [not for use in RoHS Compliant applications due to processing temperatures - see new R material below]
  R (in 1.27mm pitch) - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant applications]
  M (in 1.00mm pitch) - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant applications]
   

Packaging  
Standard Tray Pack Tray Packaging
Optional Tape and Reel Tape and Reel Packaging

    • 0.80mm BGA Socket Adapter System
    • BGA Device Socket Adapter System
    • AIC Fine Pitch BGA Socket Adapter System
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For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents.