B2B® High Density SMT Connectors from Advanced are designed for
long-life applications and robust handling. Superior quality is designed-in from our screw-machined terminals with multi-finger contacts to our heavy-duty, shrouded design which provides positive polarization to aid in blind mating applications. Low stack heights, high I/O density (over 400 contacts per square inch) and compact insulator conserve valuable PC board space.
Typlical Applications
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Telecom switches
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Servers
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Processors
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Medical equipment
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Aerospace
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Military defense systems
Features-
High density .050" (1.27mm) pitch - over 400 contacts per square inch.
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Robust screw-machined terminals with multi-finger contacts can withstand the demands of blind mating and rigorous mating/unmating cycles.
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Precision molded in high temperature LCP with integral polarization keying features to prevent 180° out-of-orientation mismating.
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At 3 amps per pin, more contacts can be assigned to data/signal transfer (fewer pins needed to handle power and ground).
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Guide box design facilitates alignment of male pin into female receptacle while protecting pins from damage during board mating.
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Industry standard footprints in four mated heights (Standard stack heights: 6.00mm, 8.00mm, 12.70mm and 19.05mm).
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RoHS Compliant models available featuring new Sn/Ag/Cu solder ball terminals.
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Customized configurations available.