Advanced Interconnections | Technical Specs

B2B® SMT Connectors

Materials
Terminals:	Brass - Copper Alloy (C36000)
Contacts:	Beryllium Copper (C17200)
Plating:	Gold over Nickel (Terminals and Contacts)
Solder Balls:	Standard: 63Sn/37Pb, Eutectic, 183°C (361.4°F) Lead-free: 95.5Sn/4.0Ag/0.5Cu, Tin/Silver/Copper Alloy, 218°C (424°F)
Body Material:	Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F)

Providing Customized Interconnect Solutions for Over 35 Years.
© 2012-2024 Advanced Interconnections Corp., West Warwick, RI USA
For details relating to proprietary information protected by patents, go to www.advanced.com/patents

Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.