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| Materials | |
|---|---|
| Terminals: | Brass - Copper Alloy (C36000) |
| Contacts: | Beryllium Copper - Copper Alloy (C17200) |
| Plating: | G - Gold over Nickel |
| M - Matte Tin over Nickel | |
| T - Tin/Lead over Nickel | |
|
Solder Preform: (Optional on some terminal styles) |
Standard: 63Sn/37Pb |
| Lead-free: 95.Sn/4.0Ag/0.5Cu | |
|
Tape Seal: (Optional) |
Silicone backed Polyimide Film, -74ºC to 260ºC (-100ºF to 500ºF), Intermittent to 371ºC (700ºF) |
| Body Material: | Peel-A-Way® - Polyimide Film, -269ºC to 400ºC (-452ºF to 500ºF) |
| FR-4 - Fiberglass Epoxy Board, U.L. Rated 94V-0, -40°C to 140°C (-40°F to 284°F) | |
| Molded - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) |



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Advanced Interconnections Corp., West Warwick, RI, USA
Phone: 1 401 823 5200
Email: info@advanced.com