Advanced Interconnections | Technical Specs

SIP Sockets & Adapters

Materials
Terminals:	Brass - Copper Alloy (C36000)
Contacts:	Beryllium Copper - Copper Alloy (C17200)
Plating:	G - Gold over Nickel M - Matte Tin over Nickel T - Tin/Lead over Nickel
Solder Preform: (Optional on some terminal styles)	Standard: 63Sn/37Pb Lead-free: 95.Sn/4.0Ag/0.5Cu
Tape Seal: (Optional)	Silicone backed Polyimide Film, -74ºC to 260ºC (-100ºF to 500ºF), Intermittent to 371ºC (700ºF)
Body Material:	Peel-A-Way - Polyimide Film, -269ºC to 400ºC (-452ºF to 752ºF) Molded - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) Molded - Molded PPS (Glass filled thermoplastic), U.L. Rated 94V-0, -60°C to 220°C (-76°F to 428°F)

Providing Customized Interconnect Solutions for Over 35 Years.
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Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.