Using our exclusive, field-proven solder ball terminal design, SMT Adapters from Advanced provide a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board connector applications.
Varies by Body Type and Pitch (see below and refer to Data Sheet)
F - FR-4 glass epoxy
U.L. Rated 94V-0, -40°C to 140°C (-40°F to 284°F)
[for RoHS Compliant applications]
M (in 1.27mm pitch) - Molded PPS (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -60°C to 260°C (-76°F to 500°F) [not for use in RoHS Compliant applications due to processing temperatures - see LCP material below]
R (in 1.27mm pitch) - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant applications]
M (in 1.00mm pitch) - Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant applications]
Made in the USA
Designed-in Globally
401-823-5200