QFP Adapters

Advanced's patented Solder Sphere Interface overcomes device obsolescence on PC boards with existing QFP pads while improving solder joint reliability. Custom designed to fit your application for converting BGA, LGA, or other device packages to an existing QFP footprint using a proven BGA-style, solder sphere interface in place of gull wing leads.

Extending Our Field-Proven Solder Ball Technology

Advanced's new patented technology utilizes our field-proven solder ball contact system to replace traditional QFP leads. The result is a lower cost, more robust interconnect solution.

  • QFP Adapter with Solder Sphere Interface - How It WorksA number of solder spheres, depending on solder volume requirements, are attached to individual pads on the custom designed Adapter or Interposer.
  • This unique process creates one large solder fillet on the QFP pad and multiple connections to the Adapter for redundancy.
  • Other components such as resistors, capacitors, etc. can be added to the top of the Adapter.
  • Device enhancements and pin-out corrections can be easily accommodated.
  • Solder spheres available in traditional Tin/Lead or lead-free Sn/Ag/Cu.
  • Outside dimensions are as small as the original device package plus 0.50mm.
  • Adapters are available as individual components or panelized.
  • Standard tray pack or optional tape and reel packaging is available.


    • AIC Custom Package Conversion Adapter BGA to QFP
    • AIC Custom Package Conversion Adapter PCB
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For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents.