QFP Adapters

Advanced's patented Solder Sphere Interface overcomes device obsolescence on PC boards with existing QFP pads while improving solder joint reliability. Custom designed to fit your application for converting BGA, LGA, or other device packages to an existing QFP footprint using a proven BGA-style, solder sphere interface in place of gull wing leads.

AIC Custom Package Conversion Adapter BGA to QFP Pads

BGA, LGA, or QFP to QFP footprint on the PCB

Customized Adapter and Interposer solutions from Advanced Interconnections eliminate costly board redesign when QFP device packages become obsolete or project requirements change. We go beyond just package conversion, adapting to your changing requirements from concept to prototype to production.

Typical Applications and Unique Features
  • Close up of AIC patented solder sphere interface for QFP pads.Transparent interface from a new QFP, BGA, or LGA device to existing QFP pads.
  • Designs from 0.50mm to 1.27mm pitch.
  • Patented solder sphere connection offers a robust, process compatible, and cost effective replacement for fragile QFP leads.
  • Solutions to obsolescence for most SMT or thru-hole lead styles.
  • Sourcing and device attach for passive and active components.
  • Stand-offs, solder preforms, SMT designs, and more.
  • Contact our Product Engineers to get started.

    • AIC Custom Package Conversion Adapter BGA to QFP
    • AIC Custom Package Conversion Adapter PCB
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For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents.