SOIC to DIP Adapters from Advanced are designed to convert rectangular type, .050" (1.27mm) pitch SOIC devices for soldering or socketing in a dual in-line (DIP or DIL) application. The Lead-free series with Immersion Gold plated pads and Gold plated terminals is RoHS Compliant and backward compatible for use in Tin/Lead applications.
Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.