IC Sockets (DIP/PGA)

Configurations are available for a wide variety of DIP (Dual Inline) and PGA (Pin Grid Array) device packages, with either traditional Tin/Lead or Lead-free terminal plating options. Also available in strips for SIP devices or board to board connector applications. 

  • High reliability screw-machined terminals with closed-end construction for 100% anti-wicking of solder.
  • Available with Gold/Gold or Matte Tin/Gold (terminal/contact) plating for lead-free compatible processing.
  • EXPRESS delivery available on select DIP models - look for the EXPRESS symbol in the catalog or on the data sheet.
  • Customized designs and surface mount options are available.

Typical Applications and Options

  • Place socket on PC board.Peel-A-Way Sockets - after carrier removal
  • Send PC board and socket through soldering operation.
  • Peel away polyimide film carrier for complete solder joint visibility or leave in place for added stability.


Typical Applications: 
  • Eliminate hand-loading of pins
  • Facilitate solder joint visibility
  • Low profile component mounting or board mating
  • Ability to remove the insulator for out gassing sensitive applications
  • Able to achieve a low profile from PCB surface to the top of the terminal head

Solder Preform Terminals

Solder Preform Terminal How It Works

Typical Applications: Intrusive reflow, eliminate need for wave soldering on mixed SMT/Through-hole boards

  • Combines the labor of socket loading and solder application into one operation.
  • Eliminates use of solder paste and the Solder Preform Terminalsscreening operation.
  • Eliminates solder bridges and/or solder shorts due to excess solder.
  • Ensures a reliable solder joint with controlled solder volume.
  • Ideal for surface mount and mixed technology applications.
  • For custom solder preform terminal applications consult factory.

Tape Seal

Removable Tape Seal

Typical Applications: Harsh environments, long term storage, applications that call for spray flux

  • Removable tape seal protects plated contacts in harsh environments.
  • Sealed socket will not allow contaminants to enter socket chamber and become entrapped behind contact fingers.
  • Spray flux without contaminating contact area.
  • Material: Silicone backed polyimide film, -74° C to 260° C (-100° F to 500° F), intermittent to 371° C (700° F). 

    • AIC Peel-A-Way® PGA Socket KSX
    • AIC Peel-A-Way® PGA Socket KS
    • AIC Peel-A-Way® DIP Socket silo
    • AIC DIP Socket Peel-A-Way PCB
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