Advanced Interconnections | Technical Specs

SocketPac® Socket Carriers

Materials
Terminals:	Brass - Copper Alloy (C36000)
Contacts:	Beryllium Copper - Copper Alloy (C17200)
Plating:	G - Gold over Nickel
	M - Matte Tin over Nickel
	T - Tin/Lead over Nickel
Solder Preform: (Optional on some terminal styles)	Standard: 63Sn/37Pb
Solder Preform: (Optional on some terminal styles)	Lead-free: 95.Sn/4.0Ag/0.5Cu
Body Material:	Peel-A-Way® - Polyimide Film, -269ºC to 400ºC (-452ºF to 752ºF)

Providing Customized Interconnect Solutions for Over 35 Years.
© 2012-2024 Advanced Interconnections Corp., West Warwick, RI USA
For details relating to proprietary information protected by patents, go to www.advanced.com/patents

Advanced Interconnections designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications including medical, military, automotive, and telecommunications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability. From prototype to production volumes, innovative designs are produced to customer-specific requirements in our fully integrated manufacturing facility in the USA.